rogers 기판

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rogers 기판

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AD250C™ Laminates 

 

  • 2.50 Dk +/-.04

  • .0014 loss tangent at 10 GHz

  • Low PIM and insertion loss

 

AD255C™ Laminates 

 

  • 2.55 Dk +/-.04

  • .0014 loss tangent at 10GHz

  • Low PIM and insertion loss

 

AD300D™ Laminates 

 

  • 2.94 Dk +/-.05

  • .0021 loss tangent at 10 GHz

  • Very good PIM performance of -159dBc at 30mil

 

AD350A™ Laminates 

 

  • 3.50 Dk +/-.05

  • .003 loss tangent at 10GHz

  • Z-Axis CTE of 35ppm/°C

 

 

CuClad® 217 Laminates 

 

  • Dk of 2.17 or 2.20

  • Uses a low fiberglass/PTFE ratio to provide lowest Dk and dissipation factor available in its class

 

CuClad® 233 Laminates 

 

  • Dk of 2.33

  • Uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties

 

CuClad® 250 Laminates 

 

  • Dk of 2.40 to 2.60

  • Uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates

 

CuClad® 6250 Bonding Film 

 

  • Dk or 2.32

  • Ethylene-acrylic acid thermoplastic copolymer bonding film

 

CuClad® 6700 Bonding Film 

 

  • Dk of 2.35

  • Chloro-trifluoroethylene (CTFE) thermoplastic copolymer bonding film

 

RO3003™ Laminates 

 

  • Dk of 3.00 +/- 0.04

  • Dissipation factor of 0.0013 at 10 GHz

  • Available with Rolled Copper

 

RO3003G2™ Laminates 

 

  • Next generation laminates for 77/79 GHz auto radar designs

  • Very low profile ED copper for lower insertion loss

  • Formulated to minimize Dk variation & enable micro vias

 

RO3006™ Laminates 

 

  • Dk of 6.15 +/- 0.15

  • Higher Dk allows for reduced circuit size

 

RO3010™ Laminates 

 

  • Dk of 10.2 +/- 0.30

  • Higher Dk allows for reduced circuit size

 

RO3035™ Laminates 

 

  • Dk of 3.50 (+/-0.05)

  • Dissipation factor of 0.0017 at 10 GHz

  • Available with Rolled Copper

 

RO3200™ Series Laminates 

 

  • Dk of 10.2

  • Available with Rolled Copper

  • Woven glass reinforcement increases laminate rigidity


 

RO4000® LoPro® Laminates 

 

  • Allows reverse treated foil to bond to standard RO4000® dielectric

  • Low DK loss for higher operating frequency designs

  • Reduced passive intermodulation (PIM) performance

 

RO4003C™ Laminates 

 

  • Original RO4000® material, used in cost sensitive Microwave/RF designs

  • Dk of 3.38 (+/-0.05)

  • Dissipating factor of 0.0027 at 10 GHz is lowest dielectric loss of R04000® product family

 

RO4350B™ Laminates 

 

  • Market leading material for base station power amplifier designs

  • UL 94 V-0 rated

  • Dk of 3.48 (+/-0.05)

  • Df 0.0037 at 10 GHz

 

RO4360G2™ Laminates 

 

  • RoHS certified

  • Low Z-axis CTE

  • Dk 6.15 (+/- 0.015)

  • Dissipating factor of 0.0038 at 10 GHz

 

RO4400™/RO4400T™ Series Bondply 

 

  • Prepreg family based on RO4000 series core materials.

  • Sequential lamination capable

  • Lead free soldering capable

  • Thinner options for improved multilayer design flexibility

 

RO4500™ Laminates 

 

  • Commercial antenna grade series for high volume designs

  • Excellent mechanical rigidity for efficient and reliable installation

  • Improved PIM when used with LoPro™ copper

 

RO4700™ Antenna Grade Laminates 

 

  • First RO4000® low Dk antenna grade material available

  • Dk 2.55 (+/- 0.05) or 3.0 (+/- 0.05)

  • Df 0.0022 at 2.5 GHz or 0.0023 at 2.5 GHz, respectively

 

RO4830™ Laminates 

 

  • Low cost solution for millimeter wave patch antenna designs

  • Insertion loss similar to RO3003™ laminate with standard ED copper at 77GHz

  • Spread glass to minimize Dk variation

 

RO4835™ Laminates 

 

  • 10x oxidation resistance compared to traditional thermoset laminates

  • Dk 3.48(+/-0.05)

  • Df 0.0037 at 10GHz

 

RO4835IND™ LoPro® Laminates 

 

  • RF laminates for 60 to 81 GHz industrial radar applications

  • Low insertion loss from LoPro® reverse treated copper foil

  • Reliable RF and mechanical performance

 

RO4835T™ Laminates 

 

  • Thin offerings of the RO4835™ Laminates

  • Spread glass minimizes Dk variation

 

CU4000™ and CU4000 LoPro® Foil 

 

  • IPC-4562A Grade 3, High Temperature Elongation Foil

  • Enables foil lamination of RO4000 Multilayer PCB

  • Simplifies Multilayer PCB registration